IEEE Components, Packaging and Manufacturing Technology Award Recipients

IEEE Components, Packaging and Manufacturing Technology Award

2009 - GEORGE G. HARMAN
NIST Scientist Emeritus
(Retired NIST Fellow)
Gaithersburg, MD, USA

"For acheivements in wire bonding technologies."

2008 -(Co-Recpients)

KARL PUTTLITZ SR.
President, Puttlitz Engineering Consultancy
Wappingers Falls, NY, USA

AND

PAUL A. TOTTA
Retired, IBM East Fishkill Facility
East Fishkill, NY, USA

“For pioneering achievements in flip chip interconnection technology and for semiconductor devices and packages”

2007 - DIMITRY GRABBE
Retired
Middletown, PA

“For contributions to the fields of electrical/electronic connector technology, and development of multi-layer printed wiring boards”

2006 - C. P. WONG
Regent’s Professor at Georgia Institute of Technology
Atlanta, GA

"For contributions in advanced polymeric materials science and processes for highly reliable electronic packages."

2005 - YUTAKA TSUKADA
Managing Director/General Manager of Advanced Packaging Technology Development
Kyocera SLC Technologies Corporation
Shiga-Ken, Japan

"For pioneering contributions in micro-via technology for printed circuit boards, and for extending the feasibility of the direct flip-chip attachment process."

2004 - JOHN W. BALDE
Senior Consultant
Interconnection Decision Consulting
Flemington, NJ

"For lifetime contributions to tantalum film technology and the introduction of new electronic packaging technology to development and manufacturing."